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Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
herausgegeben von G.Q. Zhang, L.J. Ernst und O. de Saint LegerBenefiting from Thermal and Mechanical Simulation in  Micro-Electronics presents papers from the first international  conference on this topic, EuroSimE2000. For the first time, people  from the electronics industry, research institutes, software companies  and universities joined together to discuss present and possible  future thermal and mechanical related problems and challenges in  micro-electronics; the state-of-the-art methodologies for thermal &  mechanical simulation and optimization of micro-electronics; and the  perspectives of future simulation and optimization methodology  development.  Main areas covered are:-    The impact of  simulation on industry profitability    Approaches to simulation     The state-of-the-art methodologies of simulation    Design  optimization by simulation £/LIST£ Benefiting from Thermal and  Mechanical Simulation in Micro-Electronics is suitable for  students at graduate level and beyond, and for researchers, designers  and specialists in the fields of microelectronics and mechanics.



