Buchportal für Bücher die eine ISBN tragen.

Reihe IFIP Advances in Information and Communication Technology

Springer International Publishing ×

Buchcover Product Lifecycle Management. PLM in the Age of Model-Based Engineering in Industry

Product Lifecycle Management. PLM in the Age of Model-Based Engineering in Industry

22nd IFIP WG 5.1 International Conference, PLM 2025, Seville, Spain, July 6–9, 2025, Revised Selected Papers, Part I

Springer International Publishing

Buchcover Product Lifecycle Management. PLM in the Age of Model-Based Engineering in Industry

Product Lifecycle Management. PLM in the Age of Model-Based Engineering in Industry

22nd IFIP WG 5.1 International Conference, PLM 2025, Seville, Spain, July 6–9, 2025, Revised Selected Papers, Part I

Springer International Publishing

Buchcover Product Lifecycle Management. PLM in the Age of Model-Based Engineering in Industry

Product Lifecycle Management. PLM in the Age of Model-Based Engineering in Industry

22nd IFIP WG 5.1 International Conference, PLM 2025, Seville, Spain, July 6–9, 2025, Revised Selected Papers, Part II

Springer International Publishing

Buchcover Product Lifecycle Management. PLM in the Age of Model-Based Engineering in Industry

Product Lifecycle Management. PLM in the Age of Model-Based Engineering in Industry

22nd IFIP WG 5.1 International Conference, PLM 2025, Seville, Spain, July 6–9, 2025, Revised Selected Papers, Part II

Springer International Publishing

Buchcover Advances in Digital Forensics XXI

Advances in Digital Forensics XXI

21st IFIP WG 11.9 International Conference, New Delhi, India, January 6-7, 2025, Revised Selected Papers

Springer International Publishing

Buchcover Advances in Digital Forensics XXI

Advances in Digital Forensics XXI

21st IFIP WG 11.9 International Conference, New Delhi, India, January 6-7, 2025, Revised Selected Papers

Springer International Publishing

Buchcover VLSI-SoC: Technology Advancement on SoC Design

VLSI-SoC: Technology Advancement on SoC Design

32nd IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip, VLSI-SoC 2024, Tangier, Morocco, October 6–9, 2024, Revised Selected Papers

Springer International Publishing

Buchcover VLSI-SoC: Technology Advancement on SoC Design

VLSI-SoC: Technology Advancement on SoC Design

32nd IFIP/IEEE International Conference on Very Large Scale Integration - System on a Chip, VLSI-SoC 2024, Tangier, Morocco, October 6–9, 2024, Revised Selected Papers

Springer International Publishing

Buchcover World Conference of AI-Powered Innovation and TRIZ Methodology

World Conference of AI-Powered Innovation and TRIZ Methodology

2nd IFIP WG 5.4 International TRIZ Future Conference, TRAI 2025, Paris, France, November 5–7, 2025, Proceedings, Part I

Springer International Publishing

Buchcover World Conference of AI-Powered Innovation and TRIZ Methodology

World Conference of AI-Powered Innovation and TRIZ Methodology

2nd IFIP WG 5.4 International TRIZ Future Conference, TRAI 2025, Paris, France, November 5–7, 2025, Proceedings, Part I

Springer International Publishing

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