Reihe Springer Series in Advanced ManufacturingSeonho Seok × Advanced Packaging and Manufacturing Technology Based on Adhesion EngineeringWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control MethodSeonho SeokSpringer International PublishingSoftcover2019149,79 € Advanced Packaging and Manufacturing Technology Based on Adhesion EngineeringWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control MethodSeonho SeokSpringer International PublishingHardcover2018149,79 € Advanced Packaging and Manufacturing Technology Based on Adhesion EngineeringWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control MethodSeonho SeokSpringer International PublishingeBook2018139,09 €
