Reihe Springer Series in Materials ScienceSpringer US × Solder Joint TechnologyMaterials, Properties, and ReliabilityKing-Ning TuSpringer USSoftcover2010235,39 € Evolution of Thin Film MorphologyModeling and SimulationsMatthew PelliccioneSpringer USSoftcover2010160,49 € Atomistic and Continuum Modeling of Nanocrystalline MaterialsDeformation Mechanisms and Scale TransitionLaurent CapolungoSpringer USeBook2010149,79 € Atomistic and Continuum Modeling of Nanocrystalline MaterialsDeformation Mechanisms and Scale TransitionLaurent CapolungoSpringer USHardcover2009160,49 € Evolution of Thin Film MorphologyModeling and SimulationsMatthew PelliccioneSpringer USeBook2008149,79 € Evolution of Thin Film MorphologyModeling and SimulationsMatthew PelliccioneSpringer USeBook2008149,79 € Evolution of Thin Film MorphologyModeling and SimulationsMatthew PelliccioneSpringer USHardcover2007160,49 € Evolution of Thin Film MorphologyModeling and SimulationsMatthew PelliccioneSpringer USHardcover2007160,49 € Solder Joint TechnologyMaterials, Properties, and ReliabilityKing-Ning TuSpringer USHardcover2007235,39 € Solder Joint TechnologyMaterials, Properties, and ReliabilityKing-Ning TuSpringer USHardcover2007235,39 €52 Treffer 1 2 3 4 5 6
