Verlag Springer Singaporeletzte lieferbare Neuerscheinungen: Chiplet Design and Heterogeneous Integration Packaging John H. LauSpringer SingaporeSoftcover2024 Chiplet Design and Heterogeneous Integration Packaging John H. LauSpringer SingaporeHardcover2023John H. Lau ×Bücher × Chiplet Design and Heterogeneous Integration Packaging John H. LauSpringer SingaporeSoftcover2024 Chiplet Design and Heterogeneous Integration Packaging John H. LauSpringer SingaporeHardcover2023 Semiconductor Advanced Packaging John H. LauSpringer SingaporeSoftcover2022 Assembly and Reliability of Lead-Free Solder Joints John H. LauSpringer SingaporeSoftcover2021 Semiconductor Advanced Packaging John H. LauSpringer SingaporeHardcover2021 Assembly and Reliability of Lead-Free Solder Joints John H. LauSpringer SingaporeHardcover2020 Heterogeneous Integrations John H. LauSpringer SingaporeHardcover2019 Fan-Out Wafer-Level Packaging John H. LauSpringer SingaporeSoftcover2018 Fan-Out Wafer-Level Packaging John H. LauSpringer SingaporeHardcover2018