Directions for the Next Generation of MMIC Devices and Systems

Inhaltsverzeichnis

• Scanning the Conference.
• Historical Perspectives on Microwave and Millimeter-Wave Integrated Circuits.
• Mafet Thrust 3: A Revolutionary Program for Solid-State Microwave and Millimeter-Wave Power.
• Future Directions in MMIC Research and Technology: The Wireless Pull.
• Systems and Integration.
• High Density Microwave Packaging Technology Development for Department of Defense Applications.
• Flip Chip Power MMICS Packaging Technology.
• Multilevel Vertical Interconnection Technology.
• Multilevel Packaging for Low Cost Microwave Functions.
• Future Applications of Millimeter Technology.
• Distributed Power Combining and Signal Processing in a 2D Quasi-Optical System.
• Multilayer Integration of Microwave and Millimeter-Wave Circuits: New Interconnect Methods and Design Considerations.
• The Hybrid Integration Technique of Planar and NRD-Guide Circuits for Millimeter-Wave Applications.
• Solder Free Interconnects for High Density Phased Array Integration.
• Silicon Based On-Wafer and Discrete Packaging.
• Patch-MMIC-Ferrite Integration in Novel Phased Array Technology.
• Novel Antennas and Device Technology.
• Broadbanding Guide Lines of Strip-Element Microstrip Phased Arrays.
• U-Slot Patch Wideband Microstrip Antenna.
• Surface Wave Mode Reduction for Rectangular Microstrip Antennas on High-Index Materials.
• Integrated Strip Gratings on Top of Microstrip Antennas and Arrays for Low and Ultra-Low Cross-Polar Radiation.
• A New Type of Dual Band Microstrip Array Fed by a Purely TEM Feeding Network.
• The Integrated Dielectric Slab Waveguide-Wedge Antenna.
• Dual-Polarized Rectangular Dielectric Resonator Antenna.
• SiGe MMIC’s — on the Current State-of-the-Art.
• FM Noise and Synchronization Behavior of a SIMMWIC 76.5 GHz Front-End.
• Experimental and Numerical Results on High-FrequencyNoise of Si/SiGe HBTs.
• The Development of Si and SiGe Technologies for Microwave and Millimeter-Wave Integrated Circuits.
• 94 Ghz Schottky Detector with CMOS Preamplifier.
• Semiconductor Waveguide Components for Analog Fiber-Optic Links.
• Microwave Photonic Links with Very Low (? 3 dB) Amplifierless Noise Figure.
• Polymer Optical Waveguides for Multi-Chip Modules.
• Low-Voltage MMIC HBT VCO for Millimeter-Wave Communication Systems.
• A Triple-Gate MESFET Voltage Variable Attenuator for Miilimeter-Wave Applications.
• Modeling and CAD.
• Types of Leaky Dominant Modes and Spectral Gaps on Printed-Circuit Lines.
• 2-D Integral Spectral Domain Analysis of Leaky Modes in Covered and Uncovered Microstrip Lines.
• Excitation of Leaky Modes on Printed Circuit Structures by Practical Feeds: An Investigation of Physical Meaning.
• Complex Characteristic Impedance of a Leaky Conductor-Backed Slotline: Alternate Analysis Methods.
• Suppression of Leakage on Printed Transmission Lines Using Finite-Width Dielectric Loading.
• Electromagnetic Simulation of High-Speed and RF Multi-Chip Modules — An Overview.
• Microstrip Antenna Analysis Using a Suite of Modeling Techniques-A Review.
• A New Approach to the Design of Microwave Amplifiers.
• Broadband Characterization of Representative Circuit-To-Circuit Interconnections.
• Speculations on the Next Ten Years in Electromagnetic Field Simulation.
• Ann and Knowledge-Based Approaches for Microwave Design.
• CAD Needs for Flip Chip Coplanar Waveguide Monolithic Microwave Integrated Circuit Technology.
• Computer Aided Design Tools for Microstrip Circuitries — An Application to Microstrip Patch Antennas of Circular Geometry.
• Matching and Compensation Network Synthesis for MMICs.