Interconnect Technology and Design for Gigascale Integration | ISBN 9781402076060

Interconnect Technology and Design for Gigascale Integration

herausgegeben von Jeffrey A. Davis und James D. Meindl
Mitwirkende
Herausgegeben vonJeffrey A. Davis
Herausgegeben vonJames D. Meindl
Buchcover Interconnect Technology and Design for Gigascale Integration  | EAN 9781402076060 | ISBN 1-4020-7606-1 | ISBN 978-1-4020-7606-0

Interconnect Technology and Design for Gigascale Integration

herausgegeben von Jeffrey A. Davis und James D. Meindl
Mitwirkende
Herausgegeben vonJeffrey A. Davis
Herausgegeben vonJames D. Meindl
Interconnect Technology and Design for Gigascale Integration is the cumulative effort from academic researchers at Georgia Tech, MIT, and Stanford, as well as from industry researchers at IBM T. J. Watson Research Center, LSI Logic, and SUN microsystems. The material found in this book is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in depth exploration into interconnect-aware computer architectures. This broad swath of topics presented by leaders in the research field is intended to provide a comprehensive perspective on interconnect technology and design issues so that the reader will understand the implications of the semiconductor industry's next substantial milestone - gigascale integration.