Foreword; J. P. Mucha. Editors' Introduction; P. Nordholz, H. Grabinsky. Analysis of Frequency-Dependent Transmission Lines Using Rational Approximation and Recursive Convolution; W. T. Beyenne, J. E. Schutt-Ainé. Accurate Modeling of Interconnections for Timing Simulation of Sub-Micron Circuits; D. Deschacht, E. Vanier. Minimum Realization of Reduced-Order High-Speed Interconnect Macromodels; R. Achar, M. Nakhla. Lossy Interconnect Modeling for Transient Simulations; I. Maio, F. Canavero. Algorithms Supporting Driver/Receiver Design for Multi-Conductor Interconnects; O. A. Palusinski, et al. Prediction of PCB Susceptibility to Conducted Noise at Post Layout Level; D. Lasagna, et al. Experimental Validation of a Hybrid Method that Predicts Emissions Radiated by Printed Circuit Boards; E. Leroux, et al. Hybrid Time/Frequency-Domain Simulation of Transient Electromagnetic Coupling of Interconnects; A. Dietermann, et al. Simulation of Electromagnetic Wave Propagation on a Printed Circuit Board with Linear and Nonlinear Discrete Loads; M. Witting, T. Proepper. A Model for Ground Bounce Investigation in Structures with Conducting Planes; O. Kosch, et al. Influence of a Floating Plane on an Effective Ground Plane Inductance in Multilayer Packages; M. Lopez, et al. Analysis and Measurement of Crosstalk Induced Delay Errors in Integrated Circuits; F. Moll, et al.
