VLSI-SoC: Design Trends | 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6–9, 2020, Revised and Extended Selected Papers | ISBN 9783030816407

VLSI-SoC: Design Trends

28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6–9, 2020, Revised and Extended Selected Papers

herausgegeben von Andrea Calimera, Pierre-Emmanuel Gaillardon, Kunal Korgaonkar, Shahar Kvatinsky und Ricardo Reis
Mitwirkende
Herausgegeben vonAndrea Calimera
Herausgegeben vonPierre-Emmanuel Gaillardon
Herausgegeben vonKunal Korgaonkar
Herausgegeben vonShahar Kvatinsky
Herausgegeben vonRicardo Reis
Buchcover VLSI-SoC: Design Trends  | EAN 9783030816407 | ISBN 3-030-81640-0 | ISBN 978-3-030-81640-7

VLSI-SoC: Design Trends

28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6–9, 2020, Revised and Extended Selected Papers

herausgegeben von Andrea Calimera, Pierre-Emmanuel Gaillardon, Kunal Korgaonkar, Shahar Kvatinsky und Ricardo Reis
Mitwirkende
Herausgegeben vonAndrea Calimera
Herausgegeben vonPierre-Emmanuel Gaillardon
Herausgegeben vonKunal Korgaonkar
Herausgegeben vonShahar Kvatinsky
Herausgegeben vonRicardo Reis

This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*

The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.

*The conference was held virtually.