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IUTAM Symposium on Field Analyses for Determination of Material Parameters — Experimental and Numerical Aspects
Proceedings of the IUTAM Symposium held in Abisko National Park, Kiruna, Sweden, July 31 – August 4, 2000
herausgegeben von P. Ståhle und K.G. SundinInhaltsverzeichnis
- Experimental Methods.
- Whole-Field Displacement Measurement With Moiré Interferometry as a Basis for a Microstructural FE Model of a Polymer Bonded Explosive.
- Measurement of Microscopic Residual Stress Based on the Evolution of Surface Roughness During Shallow Chemical Etching.
- The Incubation Time Theory and Experiment.
- Affordable TMF Testing Supported by FE Simulation.
- Identification of Dynamic Properties of Railway Track.
- Optical Method to Study Material Behaviour at High Strain Rates.
- Determination of Cylindrical Elastic Orthotropy in Wood by Digital Speckle Photography.
- Optimization Techniques and Simulation Methods.
- Identification of Elastic/Visco-Plastic Material Constants Under Impact Loading.
- Parameter Identification for Inverse Problems in Metal Forming Simulations.
- One Step Prediction Error Approach to the Identification Problem of Creep and Viscoplastic Material Models.
- Automated Identification and Calculation of the Parameters of Non-Linear Material Models.
- Inversion Method Using Spectral Decomposition of Green’S Functions.
- Determination of Ballast Parameters of Railway Track Using an Optimisation Technique.
- Estimation of Material Parameters at Elevated Temperatures by Inverse Modelling of A Gleeble Experiment.
- Material Modeling.
- Hydride-Induced Embrittlement in Metals -Stress and Temperature Effects.
- A Non-Isothermal Model for the Phase Transformations and the Mechanical Behaviour of a 12% Chromium Steel.
- Size Effect on Stress-Intensity Factors of CNS Specimen With an Interface Crack Subjected To Mixed-Mode Loading.
- On Pennyshaped Equilibrium Cracks in Materials Reinforced by Fibers.
- Identification of Stress from Strain for Body With Not Fully Identified Constitutive Relations.
- Evaluation Method of Interface Strength Between ThinFilms In LSI.
- List of Authors.