This comprehensive book will provide both fundamental andapplied aspects of adhesion pertaining to microelectronics in asingle and easily accessible source. Among the topics to be coveredinclude;
* Various theories or mechanisms of adhesion
* Surface (physical or chemical) characterization of materials asit pertains to adhesion
* Surface cleaning as it pertains to adhesion
* Ways to improve adhesion
* Unraveling of interfacial interactions using an array ofpertinent techniques
* Characterization of interfaces / interphases
* Polymer-polymer adhesion
* Metal-polymer adhesion (metallized polymers)
* Polymer adhesion to various substrates
* Adhesion of thin films
* Adhesion of underfills
* Adhesion of molding compounds
* Adhesion of different dielectric materials
* Delamination and reliability issues in packaged devices
* Interface mechanics and crack propagation
* Adhesion measurement of thin films and coatings
* Various theories or mechanisms of adhesion
* Surface (physical or chemical) characterization of materials asit pertains to adhesion
* Surface cleaning as it pertains to adhesion
* Ways to improve adhesion
* Unraveling of interfacial interactions using an array ofpertinent techniques
* Characterization of interfaces / interphases
* Polymer-polymer adhesion
* Metal-polymer adhesion (metallized polymers)
* Polymer adhesion to various substrates
* Adhesion of thin films
* Adhesion of underfills
* Adhesion of molding compounds
* Adhesion of different dielectric materials
* Delamination and reliability issues in packaged devices
* Interface mechanics and crack propagation
* Adhesion measurement of thin films and coatings
