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![]( "Buchcover ISBN 9781119990109")
Failure Analysis
A Practical Guide for Manufacturers of Electronic Components and Systems
von Marius Bazu und Titu BajenescuFailure analysis is the preferred method to investigate product orprocess reliability and to ensure optimum performance of electricalcomponents and systems. The physics-of-failure approach is the onlyinternationally accepted solution for continuously improving thereliability of materials, devices and processes. The models havebeen developed from the physical and chemical phenomena that areresponsible for degradation or failure of electronic components andmaterials and now replace popular distribution models for failuremechanisms such as Weibull or lognormal.
Reliability engineers need practical orientation around thecomplex procedures involved in failure analysis. This guide acts asa tool for all advanced techniques, their benefits and vitalaspects of their use in a reliability programme. Using twelvecomplex case studies, the authors explain why failure analysisshould be used with electronic components, when implementation isappropriate and methods for its successful use.
Inside you will find detailed coverage on:
* a synergistic approach to failure modes and mechanisms, alongwith reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a productdevelopment team involved
* the reasons why failure analysis is an important tool forimproving yield and reliability by corrective actions
* the design stage, highlighting the 'concurrentengineering' approach and DfR (Design for Reliability)
* failure analysis during fabrication, covering reliabilitymonitoring, process monitors and package reliability
* reliability resting after fabrication, including reliabilityassessment at this stage and corrective actions
* a large variety of methods, such as electrical methods, thermalmethods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods
* new challenges in reliability testing, such as its use inmicrosystems and nanostructures
This practical yet comprehensive reference is useful formanufacturers and engineers involved in the design, fabrication andtesting of electronic components, devices, ICs and electronicsystems, as well as for users of components in complex systemswanting to discover the roots of the reliability flaws for theirproducts.
Reliability engineers need practical orientation around thecomplex procedures involved in failure analysis. This guide acts asa tool for all advanced techniques, their benefits and vitalaspects of their use in a reliability programme. Using twelvecomplex case studies, the authors explain why failure analysisshould be used with electronic components, when implementation isappropriate and methods for its successful use.
Inside you will find detailed coverage on:
* a synergistic approach to failure modes and mechanisms, alongwith reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a productdevelopment team involved
* the reasons why failure analysis is an important tool forimproving yield and reliability by corrective actions
* the design stage, highlighting the 'concurrentengineering' approach and DfR (Design for Reliability)
* failure analysis during fabrication, covering reliabilitymonitoring, process monitors and package reliability
* reliability resting after fabrication, including reliabilityassessment at this stage and corrective actions
* a large variety of methods, such as electrical methods, thermalmethods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods
* new challenges in reliability testing, such as its use inmicrosystems and nanostructures
This practical yet comprehensive reference is useful formanufacturers and engineers involved in the design, fabrication andtesting of electronic components, devices, ICs and electronicsystems, as well as for users of components in complex systemswanting to discover the roots of the reliability flaws for theirproducts.
