Digital CMOS Circuit Design von Silvia Annaratone | ISBN 9781461322856

Digital CMOS Circuit Design

von Silvia Annaratone
Buchcover Digital CMOS Circuit Design | Silvia Annaratone | EAN 9781461322856 | ISBN 1-4613-2285-5 | ISBN 978-1-4613-2285-6

Digital CMOS Circuit Design

von Silvia Annaratone

Inhaltsverzeichnis

  • 1. Introduction.
  • 1.1. From nMOS to CMOS.
  • 1.2. CMOS Basic Gates.
  • 2. MOS Transistor Characteristics.
  • 2.1. The MOS Transistor.
  • 2.2. Parasitic Parameters.
  • 2.3. Small Geometry MOS Transistor.
  • 2.4. CMOS Transmission Gate.
  • 2.5. CMOS Inverter.
  • 2.6. A More Accurate Model for the CMOS Inverter.
  • 2.7. CMOS Power Dissipation.
  • 3. Fabrication Processes.
  • 3.1. The p-well Fabrication Process.
  • 3.2. The n-well Fabrication Process.
  • 3.3. LOCMOS Technology.
  • 3.4. Latchup.
  • 3.5. The Twin-tub Fabrication Process.
  • 3.6. The SOS Fabrication Process.
  • 3.7. Bulk vs. SOI.
  • 3.8. Design Rules.
  • 4. Logic Design.
  • 4.1. Static Logic.
  • 4.2. Dynamic Logic.
  • 4.3. Charge Sharing.
  • 4.4. Bootstrap Logic.
  • 4.5. Logic Design at the System Level.
  • 5. Circuit Design.
  • 5.1. Resistance, Capacitance, and Inductance.
  • 5.2. Modeling Long Interconnects.
  • 5.3. The Concept of Equivalent Gate Load.
  • 5.4. Delay Minimization.
  • 5.5. Transistor Sizing in Static Logic.
  • 5.6. Transistor Sizing in Dynamic Logic.
  • 6. Design of Basic Circuits.
  • 6.1. Storage Elements.
  • 6.2. Full-adder.
  • 6.3. Programmable Logic Array.
  • 6.4. Random-access Memory.
  • 6.5. Parallel Adder.
  • 6.6. Parallel Multiplier.
  • 7. Driver and I/O Buffer Design.
  • 7.1. CMOS Inverter Delay Estimation.
  • 7.2. Input Buffer.
  • 7.3. Output Buffer.
  • 7.4. Tri-state Output Buffer and I/O Buffer.
  • 7.5. Output Buffer and Bus Driver Design Optimization.
  • 7.6. Input Protection.
  • 7.7. Output Protection.
  • 7.8. Driving Large On-chip Loads.
  • Appendix A. Layout.
  • A. 1. General Considerations on Layout.
  • A.2. Layout Methodologies for Latchup Avoidance.
  • A.3. Layout with Structured Methodologies.
  • A. 4. Power and Ground Routing.
  • Appendix B. Interconnect Capacitance Computation.
  • B. 1. Case 1: Coupled Microstrip Structure.
  • B.2. Case 2: Coupled Stripline Structure.
  • Appendix C. Figures from Section 5.4.2.
  • Appendix D. Delay Minimization Based on Eq. (7-3).
  • Appendix E. Equations Related to Fig. 7-10.
  • Appendix F. Symbols and Physical Constants.